Samsung Semiconductor - M393A4K40DB3-CWE

KEY Part #: K7359901

[26077पीसी स्टक]

भाग संख्या:: M393A4K40DB3-CWE

निर्माता:: Samsung Semiconductor

विस्तृत विवरण:: DDR4 RDIMM 32 GB 2R x 4 3200 Mbps 1.2 V 288 (2G x 4) x 36 Sample.

Manufacturer's standard lead time:: स्टक मा

आफ्नो जीवन:: एक वर्ष

बाट चिप:: हंगकंग

RoHS:

भुक्तानी विधि:

ढुवानी मार्ग:

परिवार कोटिहरू:: KEY कम्पोनेन्ट्स कं, लिमिटेड एक इलेक्ट्रोनिक कम्पोनेन्ट वितरक हो जसले निम्न सहित उत्पादन कोटीहरू प्रदान गर्दछ: HBM Aquabolt, MODULE, LPDDR3, DDR4, DDR3, GDDR6, LPDDR4 and HBM Flarebolt ...

प्रतिस्पर्धी लाभ:: We specialize in Samsung Semiconductor M393A4K40DB3-CWE electronic components. M393A4K40DB3-CWE can be shipped within 24 hours after order. If you have any demands for M393A4K40DB3-CWE, Please submit a Request for Quotation here or send us an email: rfq@key-components.com

GB-T-27922

ISO-9001-2015

ISO-13485

ISO-14001

ISO-28000-2007

ISO-45001-2018

M393A4K40DB3-CWE उत्पाद गुणहरू

भाग संख्या : M393A4K40DB3-CWE

निर्माता : Samsung Semiconductor

वर्णन : DDR4 RDIMM 32 GB 2R x 4 3200 Mbps 1.2 V 288 (2G x 4) x 36 Sample

श्रृंखला : DDR3

DDR : DDR4

Dimm प्रकार : RDIMM

घनत्व : 32 GB

रैंक संगठन x। : 2R x 4

गति : 3200 Mbps

भोल्टेज : 1.2 V

पिन को न : 288

घटक संगठन : (2G x 4) x 36

उत्पादन स्थिति : Sample

ताजा समाचारहरू

Autonomous Driving and the Quest for Safety

Mission Peak Reference Server System for NGSFF SSD

Samsung Launches Industry’s First 12Gb LPDDR4 DRAM

Samsung Electronics Starts Mass Producing Industry’s First 8-Gigabit Graphics DRAM (GDDR5)

[Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions

Mass Production of Fifth-Generation V-NAND has Started

Bringing Artificial Intelligence to Devices Everywhere

An Exclusive Look Inside Samsung’s Memory Exhibit at MWC

Inside the building blocks of the 5G future

Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards

Automotive Driven by Small Packages Under the Hood

Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology

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